- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
Patent holdings for IPC class H01L 21/3213
Total number of patents in this class: 5176
10-year publication summary
542
|
637
|
509
|
587
|
699
|
665
|
462
|
394
|
344
|
111
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
903 |
Tokyo Electron Limited | 11599 |
400 |
Applied Materials, Inc. | 16587 |
317 |
Samsung Electronics Co., Ltd. | 131630 |
243 |
International Business Machines Corporation | 60644 |
218 |
Lam Research Corporation | 4775 |
206 |
Micron Technology, Inc. | 24960 |
127 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
96 |
Kioxia Corporation | 9847 |
82 |
United Microelectronics Corp. | 3921 |
81 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
76 |
Boe Technology Group Co., Ltd. | 35384 |
71 |
Texas Instruments Incorporated | 19376 |
69 |
Tokyo Electron U.S. Holdings, Inc | 608 |
69 |
SK Hynix Inc. | 11030 |
65 |
Samsung Display Co., Ltd. | 30585 |
57 |
Nanya Technology Corporation | 2000 |
42 |
ASM IP Holding B.V. | 1715 |
41 |
Semiconductor Manufacturing International (Beijing) Corporation | 1019 |
39 |
Changxin Memory Technologies, Inc. | 4732 |
39 |
Other owners | 1935 |